Description

Field of Applications

• It is used for bonding polystyrene (XPS or EPS) boards used in thermal insulation of buildings and building elements such as decorative jambs.

Advantages

• It fills the gaps, insulates and protects the building elements.
• Adheres heat insulation plates quickly.
• Provides thermal insulation.
• It does not create a thermal bridge.
• It is economical.
• Easy and fast to apply.
• Boards can be doweled and plastered approximately 2 hours after the application.
• Thanks to its high foam stability, the product that completes its curing does not swell or shrink.
• It has a very strong bonding feature.
• It can be used between 0°C and +40°C.