Description

Fields of Application

• Used for bonding polystyrene (XPS or EPS) plates used in heat insulation of buildings and decorative elements such as jambs

Advantages

• It fills, insulates and protects the gaps between the building elements.
• Adheres heat insulation plates quickly.
• Provides thermal insulation.
• It does not create a thermal bridge.
• It is economical.
• Easy and fast to apply.
• Boards can be doweled and plastered approximately 2 hours after the application.
• Thanks to its high foam stability, the product that completes its curing does not swell or shrink.
• Has a very strong bonding feature.
• Can be used between 0°C and +40°C.